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Why Flip-Chip COB Technology Is the Future Rather than Lateral?

From:Time:2022-06-10

In the past few years, technological development has witnessed the domination of Chip on Board LED display in the market and its leading role in the ultra-fine-pitch LED display screen. COB technology shines in the ultra-fine-pitch LED display screen market as the core technology.

 

Simultaneously, it is gradually divided into flip-chip COB technology and lateral COB technology. Due to a brighter future and development, flip-chip COB technology has attracted wide attention. Thus, this article will guide you to learn more about flip-chip COB technology and lateral COB technology.

 

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(Copyright photo from: https://unsplash.com/photos/AsEz8yUN-k4)

 

What Is Lateral COB Technology?

Lateral COB technology is the packaging technology applied to COB LED display at the early stage. However, the welding way between the chip and the PCB board in lateral COB technology limits the performance of products technically. For instance, the electrode and wire are on the side where it emits the light, affecting the angle where the LED chip emits the light and reducing the contrast ratio of the display screen to a certain extent.

 

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What Is Flip-Chip COB Technology?

Flip-chip COB technology, the state-of-the-art and widespread COB packaging technology, directly integrate the crystal particles of the LED chip into the PCB board. This technology solves heat release caused by the inefficient heat conductivity coefficient of sapphire and Gallium arsenide substrate. It directly connects larger areas of electrodes to the PCB board, resulting in better heat dissipation and a longer life span of the device.

 

Why Is COB Technology Critically Acclaimed?

The reason why flip-chip COB technology is sought-after in different industries lies in endeavors made by COB suppliers. Let’s take HCP as an example, and you will figure out why our COB LED displays are becoming essential.

 

1.  Discover and Satisfy the Need of Users

The traditional display can hardly avoid delay in display response, so it can not be geared to industries that require a high refresh rate and quick response. An upward trend is seen in the popularity and the number of e-sports as it has been nationally recognized. Nevertheless, audiences place more emphasis on wonderful scenes in the game than on tactics players use.

 

The mini COB LED display of HCP, using flip-chip COB technology, is conducive to the perfect presentation of the wonderful world in the game and has a great visual effect on viewers. On the one hand, the mini COB display screen makes a quick response at the nano-level speed, with a refresh rate up to 7,680 Hz.

 

On the other hand, the mini COB LED display is equipped with 5G broadband for transmission, 8K resolution, 15000:1 ultra-high contrast, and 1200Nits brightness. Thus, it offers a high-definition image while protecting your eyes, making it a perfect large-screen display solution with a high refresh rate and quality.

 

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(Copyright photo from: https://unsplash.com/photos/8dUEDo6u1Ao)

 

2. Develop the New Patent to Solve the Bottleneck

The traditional way to transfer the chip imposes restrictions on the size of a single chip. If the chip is too small, it is impossible to be transferred, which can hardly meet the development demand of LED microchips. To solve this problem, suppliers need to tackle the challenge of doubling pixel density and substandard percent of yield rate.

 

The UFP series LED display of HCP uses flip-chip COB technology, getting the patent of mass transfer technology. This patent makes millions of micron chips to be put on the PCB board with UPH (unit per hour) greater than or equal to 2.5kk per hour, accuracy up to 5μm, and the yield rate of more than 99.999%.

 

3. Upgrade the Functions and Lower Maintenance Costs

With the help of flip-chip COB technology, the mini COB LED display of HCP boasts great protection ability with a smooth surface and no exposed components. On the one hand, since the flip-chip COB technology does not require wires, positive and negative electrodes of the luminous chip are directly welded to the PCB board, reducing the solder dot and fault point while improving reliability and stability in general.

 

On the other hand, the surface of the LED screen is smooth and hard with waterproof, dust-proof, anti-static, anti-impact, anti-scratch performance, achieving high stability and easy maintenance.

 

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About HCP

HCP, the mini COB LED display supplier, devotes itself to offering indoor display solutions in all aspects. Specializing in COB technology, we commit ourselves to provide clients with more high-quality and sophisticated LED displays. Since we are combined with advanced flip-chip technology and massive transfer technology, our mini COB LED display is welcomed and praised by users at home and abroad. Thus, if you have any questions, please get in touch with us.

Contact Us

Contact

Dongguan HCP Technology Co.,Ltd

Add No. 17, Sangyuan Industrial Road,Dongcheng District, Dongguan City,Guangdong Province, China, 523000

Tel+86 769 86738999

Emailinfo@hcpled.com

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