technology technology


Mass Transfer

HCP's patented mass transfer technique is a novel approach for transferring millions of Micro LED chips with accuracy.
Mass Transfer
Chip on Board

Chip on Board

Flip chip with COB packaging makes wire bonding not required, 
which can greatly extend the lifespan and lower the maintenance cost.

Flip chip technology

Flip Chip design allow packaging of more chips in the same area, which greatly improves the performance and reliability of advanced LED displays.
The no wire bonding structure allow the LED display with high reliability, low thermal resistance and better output of light.

improved color accuracy

lower power consumption

better heat dissipation

Flip chip technology

Surface Treatments

UFP series provides three types of surface treatments, including Glossy, Satin and Matte,
enhancing the color uniformity for the diversity of applications.






Dongguan HCP Technology Co.,Ltd

Add No. 17, Sangyuan Industrial Road,Dongcheng District, Dongguan City,Guangdong Province, China, 523000

Tel+86 769 86738999